The purpose of this manual is to provide information on the quality and reliability of the products supplied by MST. MST maintains a wide range of products to supply customers worldwide. The range of products offered includes but is not limited to power management, LED lighting, security and industrial, automotive electronics, industry customized products.
These quality-related materials were originally created for MST internally to serve as performance benchmarks, and they define the quality objectives within MST. This manual is not a product specification. MST strives to follow these procedures and internal "requirements"; We attempt to provide our customers with up-to-date and accurate information about their products and quality processes, but we cannot guarantee that we will perform well in every case or that we will be able to successfully update these materials in every case without any errors or errors. Therefore, this information is provided "AS IS" AND MST DISclaims ALL implied or EXPRESS warranTIES that may be contained in such MATERIALS, including, but not limited to, ALL warranties of any fitness for any purpose, title to all intellectual property rights or non-infringement, express or implied warranties.
Firmly believe that MST's pursuit of quality and reliability will enable our customers to see the company's commitment as quality. We recognize that without the effectiveness of a well-structured reliability program, we will not achieve lasting quality.
If you have any questions about the contents of this manual, please contact MST at www.mst-ic.com.
catalogue
Introduce
Quality system
Standard reliability and qualification tests
Reliability testing and analysis
Customer process change notification
Customer return
Fault analysis
Supplier quality process
External manufacturing quality
Sum up
MST creates, manufactures and sells a wide range of integrated circuits. We provide our customers with a single source of product supply based on all their actual needs for the product. MST's product portfolio is one of the most stable in the semiconductor industry due to its breadth, long market life cycle and absolute diversity.
MST Quality Policy Statement：
MST achieves operational excellence through the following strategies：
-Encourage and expect the creative dedication of every MST employee.
-Listen to customer requirements and make every effort to meet them.
-Continuous improvement of processes, products and services.
Customer satisfaction and continuous improvement inspire customer confidence in MST; These are the foundations of customer relationships. The idea of quality determination is deeply rooted in every employee's heart. MST understands that for any manufacturer to be successful, its products must meet and consistently exceed the pressing requirements and needs of its customer base.
At MST, the major categories of semiconductor products are monitored for quality and reliability. These monitors are designed to test product design and materials, as well as to identify and eliminate potential failure mechanisms. The goal of ongoing monitoring is to provide reliable product performance in real-world applications and to capture trends that will enable MST to continuously improve its products. In addition, this data is used by our customers to make failure rate predictions. This manual is dedicated to the compilation of quality and reliability test protocols. Detailed reliability reports for the specified product family or product type are available on demand and can be obtained through your local MST customer representative or from the MST Product Information Center.
MST's Quality theory is based on the philosophy that MST is committed to innovating, manufacturing, and selling useful products and services to meet the needs of customers worldwide. The concept has stood the test of time, providing the basis for many improvements in MST's premium journey.
Quality System Manual (QSM)
The purpose of the MST quality system is to define minimum business processes and implement a basic quality operating system to meet customer needs. This system focuses on enhancing all aspects of the business and is structured by the unique requirements of MST. These requirements add value to our internal operations and external customers and further build our robust business operating systems.
ISO 9000 / TS 16949
The MST Quality system defines minimum quality requirements for all operations worldwide. It is based on certified industry and international standards such as the International Organization for Standardization (ISO) 9000 and Technical Specifications (TS) 16949. MST performs annual mandatory internal audits to monitor compliance with these requirements and drive continuous improvement.
Examine
MST has initiated a group audit function with the authority to conduct audits of quality procedures and practices worldwide. All audits are conducted for three purposes: (1) to achieve the adjustment of local operating practices through the quality system; (2) Establish effective and complete process and product quality control, and (3) act as a monitor of manufacturing specifications and engineering structural integrity to measure operational compliance with local codes.
Policy deployment
Policy deployment is a fundamental component of MST's strategic quality planning process. We use an annual process to establish, deploy and implement measures to address semiconductor group priorities. This process is used to define the strategies needed to close large gaps and produce the best results.
Policy deployment can be used：
Communicate the group's vision and priorities to all levels of the organization.
Build a development and support plan and strategy structure to achieve priorities and accomplish goals well.
Improve communication and interaction within all employees and functions so that each person understands his or her role in achieving the Group's goals.
Unresolved customer priorities and chronic issues are barriers to achieving superior performance.
Provide a management audit process to ensure that projects meet plans and provide recognition of success.
Statistical Process Control (SPC)
SPC is used to improve overall process capability and minimize process variability. The main objectives of the SPC include：
Control daily processes
Improve Process Capability (Cp)
Reduced variability of target values (Cpk)
Eliminate exceptions or exception batches
Achieve reliable delivery
Reduce quality cost
MST will continue to strive to find new ways to improve product quality and is committed to using SPC. Our operators are trained in the use and application of process control technology that can lead to significant process improvements.
The variability of the process leads to the variability of the product in production. Statistical process control (SPC) is used at all stages of manufacturing to replace predictability with variability. However, traditional ideas in the semiconductor industry enable final testing to determine product acceptability as measured by data sheet specifications, and MST uses SPCS to ensure that parts are added to specific process objectives during the manufacturing cycle. It should be emphasized that the purpose of SPC is to prevent defects rather than detect them. Excellence in design, process, material sourcing and selection, combined with manufacturing strengths, enables MST to produce high quality and highly reliable products.
Failure Mode and Impact Analysis (FMEA)
MST uses FMEA as a set of systematic activities aimed at：
Identify and evaluate potential failure modes and causes associated with product design and manufacturing.
Identifies actions that eliminate or reduce the probability of a potential failure.
Document the process.
FMEA is an aid to the design process and is used to determine how the design should meet customer requirements. Timeliness is one of the most important factors in the successful implementation of the FMEA program. If applied properly, it becomes an interactive, circular process that never ends.
Customer satisfaction
MST operates in a highly competitive global market. There can be no development if we continue to dwell on our traditions and past achievements. We constantly understand our customers' needs for service and support by focusing on customer service. The key factor is that we receive feedback on the quality of our products and services. We need a deep understanding in order to design solutions based on the product and service needs of our customers. This means listening to them from a system-wide perspective on how we can better serve them, from the introduction of the idea to the successful delivery of the product or service. How do we know for sure? By asking customers how they perceive the quality of MST's products and services and asking them what they expect from MST. This can be done by conducting regular quality surveys and providing feedback using customer scorecards. The objectives achieved through the survey are:
Continuously enhance our next generation of business operating systems by identifying our customers' current business expectations.
Baseline measurement of our performance against customer expectations.
Keep track of changing expectations and modify our quality systems accordingly.
It provides the basis for a set of customer satisfaction indicators that check our internal quality tests.
Therefore, every company must develop customer-oriented metrics, use factors established by customers, and set aggressive improvement goals. As customer expectations continue to rise, these metrics are also expected to change over time.
Client presentation and defense
Each business segment has a customer quality representative representing each internal organizational customer, who is responsible for communicating and providing solutions to quality issues. They work collaboratively with customers to understand their quality requirements and expectations, and then establish MST programs to serve customer needs and improve relationships. The results of the customer scorecard are reported to the organization and actions are taken to improve the reported metrics. They also coordinate with sales teams and factories in some or all of the following situations:
Use the MST database
New Product Qualification and Process Change Notification (PCN)
Eliminate customer dissatisfaction in a timely manner
Daily customer quality data requirements
Product prevention and corrective action
Yield increase
Quality improvement plan
For semiconductors, the common key performance of the device makes quality particularly important. MST designs semiconductors with the idea that the actual life of the product is much longer than the expected life of its final product, and the superb process helps each product meet its design specifications.
All MST products are certified and tested for reliability (or performed by a similar certification body) before being released as production materials. The reliability and quality methods outlined in this document help achieve Six Sigma performance in all operations.
Reliability stress test
MST provides reliability tests, which are commonly used in the corresponding product development and qualification.
The products of MST are tested by professional organizations and fully comply with the various standards of the industry.
MST performs extensive reliability stress testing on products across the entire product range. Reliability data is collected as part of MST's ongoing reliability monitoring program and as part of the product qualification process. This data is constantly updated and available to customers upon request.
Failure rate
By definition, reliability is the probability that a product will perform its specified function within a specified time and under specific environmental conditions. In general, reliability can be viewed as the performance of maintaining acceptable quality over time and environmental conditions. The important characteristic of reliability is the risk rate h(t).
Risk rate is a rough representation of the probability that a product will fail while in operation. The most commonly used probability distributions for analyzing reliability data of semiconductor products are exponential and Weibull distributions. For modern semiconductor products, the failure rate is very low; The failure rate is expressed in FIT units, where FIT is the number of failures in a billion product working hours.
In order to understand the uncertainty that arises from calculating the failure rate from the sample, a confidence bound must be applied for the point estimate. The relevant confidence interval for product reliability calculation is a one-sided upper confidence interval for the failure rate. A unilateral upper confidence interval provides an assessment of the failure rate that will not fall below any given point within a given confidence level. If the failure rate of the exponential distribution is to be correctly sampled, the Chi square (Χ2) distribution should be used. This means that if you want to calculate the failure rate of many independent samples taken from the same exponential population, the point estimate distribution of the failure rate should follow the chi-square distribution.
Accelerated stress test
Due to continuous process improvements and improvements in product and packaging technology, the failure rate of semiconductor products is extremely low. To accurately assess the reliability of these products, our reliability engineers use accelerated stress test conditions during reliability testing. These test conditions are carefully selected to accelerate the occurrence of failure mechanisms expected to occur under normal service conditions without the need for fictitious failure mechanisms. Accelerated stress testing is used to assess product reliability performance under service conditions and to help identify opportunities to improve product reliability performance. Fault mechanisms discovered during stress testing can be traced back to the source at any time and then eliminated.
Temperature is the most commonly used stress accelerator. In most cases, raising the temperature increases the probability of a given failure mechanism. There are also failure mechanisms that are accelerated by the use of lower temperatures. The simplest thermal acceleration model used by MST is the Arrhenius equation. By using the Arrhenius equation, the failure rate under one pressure condition can be compared with the failure rate under other pressure conditions. The acceleration factor defined by reliability engineering is used to convert stress test time to equivalent time at common junction temperatures.
Activation energy
For those fault modes accelerated by temperature, in order to calculate the acceleration factor from the stress test condition to the service condition, we use activation energy in the derating model. Usually the Arrhenius equation is used, where the acceleration factor (AF) is given in accordance with
AF = exp (-Ea/kT)
Ea :Activation energy，K :Boltzmann constant，T :Temperature difference between pressure temperature and service temperature (Kelvin).
MST typically uses an industry-standard activation energy assessment, which is documented on "Failure Mechanisms and Models for Silicon Semiconductor Devices" on page 122 of the EIA/JEDEC publication. In addition, MST will use values based on knowledge models. The following table summarizes the most commonly used activation energies.
device association | breakdown | Accelerate | Q |
Chip surface oxide | Surface inversion Mobile ion Charge accumulation Surface charging coverage area | T，V | 1.0 |
Gate oxide | Dielectric breakdown
| E，T | 0.3 |
metallization | electromigration
| J，T | 0.48 |
corrosion
| H，E/V，T，V | 0.8 | |
Assembly process | Metal compound
| T | 1.0 |
Lead welding Chip bonding | T，∆T | 0.75 |
T= temperature ∆T = Temperature cycle V= voltage | E = Electric field J = Current density H = humidness |
Other accelerators used may be voltages for life testing, temperature periods (maximum and minimum temperatures, heating rates and dwell times) for mechanical testing, and temperature and humidity for corrosion testing.
Thermal resistance
Circuit performance and long-term circuit reliability are affected by chip temperature. Generally, they can be raised by keeping the junction temperature low. The electrical energy consumed in any semiconductor becomes a heat source. This heat source raises the chip temperature above a certain reference point, typically 25 ° C in still air. The increase in temperature depends on the amount of electrical energy consumed in the circuit and the net thermal resistance between the heat source and the reference point.
The junction temperature depends on the ability of the packaging and mounting system to dissipate the heat generated on the circuit from the connection area to the surrounding environment. For more details on how to use and measure package thermal resistance, see MST's application manual IC Package Thermal Metrics.
Air flow
The air flow over the package reduces the thermal resistance of the package, allowing the power consumption to increase accordingly, but not exceeding the maximum allowable operating junction temperature. For thermal resistance values for specific packages, see the respective product data sheet or contact your local MST sales office.
MST has established a JESD46C-compliant system that notifies customers of product or process changes that affect shape, suitability, function, or adversely affect product quality or reliability. The change notification process notifies customers of changes at least 90 days prior to the change and provides a feedback channel for sample requests, data, and confirmations in other requests throughout the process.
Obsolescence (EOL) notices are issued in accordance with the latest version of JESD48. MST provides a 12-month lead time for the final order and extends the final lead time for discontinued products by an additional 6 months.
You can implement changes or suggest PCN/EOL contacts by contacting the appropriate customer quality engineer or MST's PCN team.
MST takes all customer returns seriously. We recommend that customers contact MST directly in order to clarify the appropriate action when returning a product or initiate an investigation into certain types of products. For customers who wish to return products to MST, MST has a clear customer return process to initiate and process returns. For more information on how to process returns, please contact your customer service representative, MST authorized reseller, or MST's Product Information Center. Once MST receives the return, appropriate testing and analysis will be arranged to confirm customer issues.
We keep in touch with our customers from start to finish, including but not limited to the following processes:
Fault analysis
Customer issue notification and submission
MST sample receipt
Startup problem verification
Complete fault or problem analysis
Complete the final corrective action plan
Implement and verify corrective and preventive actions
Customer event flow chart
Customer events are tracked through the Customer Event Information System. Summarize and release customer event assessment indicators every month within the company. The timeliness assessment index is used to promote the continuous improvement of completion time. Fault mechanism Plato is used to drive continuous improvement in all areas of quality. Together with the Business and Manufacturing departments, the above indicators are evaluated on a monthly and quarterly basis.
Fault analysis (FA) is a process that requires a large number of analytical methods and techniques to solve reliability and quality problems that may arise in the manufacture or application of a product. Because so many aspects of the process are related to the advancing semiconductor and packaging technology, as well as the large number of engineering subjects involved, it is quite a complex process. FA engineers or FA analysts must be proficient in design, processing, assembly, testing, and application, which requires knowledge of physical, electronic, chemical, and mechanical engineering.
MST has analytical LABS at its global manufacturing facilities for customer returns, reliability failures, manufacturing failure analysis, and design support. Analysis They are equipped with the same analytical tools for finished product analysis, process characteristics analysis, destructive physical analysis and structural analysis. The advanced development of tools for fault analysis is synchronized with the manufacturing speed. While laboratories keep pace with technology, analysts must constantly develop tools and techniques related to technology. Since the chip size is reduced and multi-layer connections are covered, the need for fault analysis needs to be considered in advance in the design process. By combining a specialized test structure with functional test coverage, it is easier to diagnose problems. In addition to tools, use personnel training, technology, procedures, data warehouses, tracking systems, and data research to accelerate problem identification, isolation, and resolution.
MST's laboratories are equipped with a wide range of equipment and engineering expertise to solve problems from all areas of semiconductor technology and packaging analysis. The success of fault analysis depends not only on the sophistication of the experimental equipment, but also on the personnel and their experience in solving the problem. While failure analysis LABS are sometimes able to identify failure mechanisms, actually tracing the root causes of failures has only just begun. Due to the complexity of products and manufacturing processes, root cause analysis requires many specially designed experiments to determine root causes and verify the effectiveness of possible corrective actions. The entire process of solving a problem sometimes requires the involvement of multiple laboratories and technologies. Fault analysis experts and specialists in various topics need to work together to solve problems.
Fault analysis process overview
The following steps outline the basic steps that will be used in the laboratory to analyze customer returns.
Required information
The more detailed the information the better! Analysis requires minimal background information, which greatly affects the overall analysis quality and analysis time during problem solving. The following required information must be provided:
Failure history and failure rates at customer sites, applications, and related products. Is it a new product, or have there been any changes during this time?
The duration and condition of the application at the time of the failure. Did any other products fail at the same time, and if so, how did they fail? Can you send schematics? Are the same batch of products available?
The failure mode of the application and how does it relate to this product? How do you perceive that the product is faulty (short circuit, open circuit, logic level, etc.)?
The processing performed on the product prior to receipt by the MST. Special attention needs to be paid to protective measures during removal and handling (ESD) products, to ensure that damage to other electrical properties or items is avoided, and to maintain the testability of product packages.
Diagnostic test
Faulty products often employ "pin-to-pin" measurements and comparison with known good samples to quickly diagnose parametric anomalies. Depending on the failure mode, the product is tested on a more powerful test bench, while stress conditions are applied to match the customer's application or simulate the failure mechanism.
Nondestructive testing
The process of fault analysis is itself reverse engineering, that is, dissect the returned product. Since the package must be at least partially opened to expose the chip, it is necessary to observe the package or assembly structure with non-destructive testing techniques from the beginning. The most commonly used techniques are ultrasonic microscopy and X-ray (XRAY) examination, which can be used to check for abnormalities in internal connections or plastic sealing.
Internal inspection
Internal observation is used to check for obvious assembly anomalies or wafer process problems. Retesting is often used to determine if the failure mode has changed.
Internal diagnostic test
In many cases, internal inspection reveals no obvious mechanism of failure. Depending on the test technique and level, the laboratory may use one or more techniques to identify the fault location. This may require extensive probe exploration or special techniques to highlight abnormal areas. These techniques mainly try to discover the characteristics of the fault location, such as whether it is heat dissipative or light excited. From a probe perspective, navigation tools such as laser microcutting or focused particle beam (FIB) techniques are used to confirm product and circuit failures.
delamination
Stripping is a repetitive process used to remove the chip's surface material layer by layer, which can be exposed by wet chemical corrosion or dry plasma etching. Because of its destructive nature, and the risk of losing critical information in the process, it is vital to adopt the right approach.
Fault location analysis
Once a possible fault location is found or located, it needs to be documented and analyzed. Whether further structural or material composition analysis is required can be determined according to actual needs.
Report conclusion
Once the analysis is complete, write a report to document the work. The report needs to state how the physical exception relates to the failure mode. Adequate root cause analysis should also be summarized and confirmed by the manufacturer.
outline
Fault analysis is a detailed and complete process. In order to maximize the use of resources, MST requires customers to provide all relevant background information when submitting a fault analysis request, and to ensure smooth communication channels between MST and customers. Achieving customer satisfaction through failure analysis is what MST is determined to do, and through this effort to increase customer satisfaction.
Supplier quality objective
Supplier quality is a key factor in determining whether MST can meet customer expectations. It is the responsibility of the supplier to fully support MST in achieving this objective, and MST should also work internally with its suppliers to achieve this level of support. As one of the few semiconductor companies to receive ISO/TS 16949:2009 enterprise certification, MST requires its significant suppliers to be certified to ISO 9001:2008 and to be certified to ISO 9001:2000. We plan to make our direct material suppliers meet ISO/TS 16949:2009. Direct materials are materials used in manufacturing processes, products that become equipment, or materials used in product delivery. In addition to any quality certification required by the MST business, it needs to be confirmed in the certification database.
expect
MST suppliers will use an evaluation process that supports the development of a Quality management system (QMS). MST expects suppliers to develop their QMS to enable continuous improvement, prevent defects, and reduce bias and waste in the supply chain. As customer expectations continue to rise, supplier performance is expected to be world-class.
We may use a variety of criteria to measure suppliers, including but not limited to the criteria listed below. For specific requirements, MST encourages suppliers to contact their MST Account Manager and/or purchasing department.
Quality certification
Iso 9001:2008 or Iso / ts 16949:2009。
The quality of the product delivered
Accept and comply with the accuracy of the certificate
Return rate (in PPM)
Customer outages, warnings, or internal warnings
Supplier quality problem
The root cause of MST customer outages is attributed to the supplier.
MST Quality warning
MST Internal quality warning
Corrective Action Response - Suppliers are expected to provide MST with timely notice of any issues and to respond when all issues are notified by MST. At the same time, we hope to take a series of follow-up measures to contain the development of the problem until the problem is solved. Corrective actions also include identifying the root cause, implementing and validating measures, and identifying appropriate actions to prevent the problem from recurring.
Lead time performance includes additional costs incurred by shipping events
Change management performance
Consistency with MST change Control protocols (per class).
Supplier product part approval process
Qualification and Change Notification - The Supplier is responsible for assessing any changes to the process that may affect the form, suitability, function, quality or reliability of materials supplied to MST. Changes cannot be made or products affected by such changes delivered without prior notice to MST as required.
Strict compliance with controlled chemical and material requirements
MST leverages wafer foundries and assembly subcontracting partners to meet customers' increasing demands for high-quality, low-cost semiconductors. Our global foundries and assembly subcontracting partners are responsible for some or all regions of semiconductor manufacturing. This includes wafer fabrication, wafer probes, assembly, testing, and product analysis and reliability testing. When MST selects a new manufacturing partner, a thorough assessment of the company's ability to meet MST's high quality, business and technical requirements is required. We are also looking for partners who can develop together with MST and its customers.
For current manufacturing partners, a continuous improvement plan is essential, which Outlines aggressive improvement goals. Periodically assess progress against these goals.
New product introduction and process change control requirements and specifications are the same for internal MST plants and external manufacturing partners. While the quality system will vary from partner to partner, MST requires each supplier to use the same high standards to manufacture products as an in-house factory. Before selecting a manufacturing partner as a new supplier or adding a new or expanded production line, MST performs a thorough evaluation. This includes assessment of machine functions and maintenance, process documentation and control, personnel training and authorization, process FMEA, and many other aspects. In addition, detailed project management methods are used to ensure that projects are completed on time. MST encourages each manufacturing partner to continue to participate in external certification to drive the improvement of their quality systems.
In addition, we introduce many of our in-house plant quality system practices to external partners. Conduct regular business reviews to see improvement in key performance indicators, including customer quality and delivery. Participate in the development of corrective action plans and agree on how to resolve problems as quickly as possible and achieve continuous improvement.
We hope this manual will give you an idea of MST's efforts in quality and reliability. If you have any questions, please contact MST through the Product Information Center at www.mst-ic.com. At the same time, we sincerely hope that you will continue to enjoy our excellent quality and excellent reliability.
MST and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements or other changes to the products and Services offered at any time without prior notice, and to discontinue the provision of any products and services at any time. Customers should obtain the latest relevant information before placing an order and verify that this information is complete and up-to-date. All products are sold in accordance with the MST Terms and Conditions of Sale provided at the time of order confirmation.
MST guarantees the performance of the hardware products it sells in accordance with the applicable specifications of the MST Standard warranty. Testing or other quality control techniques are used only to the extent guaranteed by MST and when MST deems it necessary. Unless the government makes it mandatory, it is not necessary to test all the parameters of each product.
MST assumes no obligation for application assistance or customer product design. Customers are solely responsible for their products and applications using MST products. To minimize the risks associated with the Customer's products and applications, the Customer shall provide adequate design and operational safety measures.
MST makes no warranties or interpretations of any direct or implied rights granted in any MST patents, Copyrights, rights to block works, or other MST intellectual property rights relating to a combination of equipment, machines, or processes using MST products or services. Information posted by MST regarding third party products or services does not constitute a license, authorization, or endorsement from MST to use those products or services. The use of such information may require a license under a third party's patent or other intellectual property rights, or MST's patent or other intellectual property rights.
Reproduction of MST information in MST data manuals or data tables is permitted only in the absence of any tampering with the content and with the relevant authorizations, conditions, restrictions and declarations. Tampering with the content in the process of copying information is an illegal and fraudulent business practice. MST assumes no liability for such altered documents. Third party information may be subject to other restrictions.
When reselling MST products or services, if there is a misrepresentation of the product or service parameters, you will lose the express or implied authorization of the relevant MST products or services and this is an illegal and fraudulent business practice. MST assumes no liability for such misrepresentations.
MST products are not authorized for use in safety-critical applications, such as life support applications, where a failure of an MST product would be expected to cause significant loss of life, unless officials have reached an agreement specifically to regulate such use. By purchasing, purchasers acknowledge and agree that they have all the expertise and knowledge necessary for the safety and regulatory derivation of their application, although any application related information or support may still be provided by MST. However, they will be solely responsible for meeting all legal, regulatory and safety-related requirements for the use of their products and MST products in safety-critical applications. In addition, purchasers must fully indemnify MST and its representatives for damages caused by the use of MST products in such safety-critical applications.
MST products are not designed for, and are not intended for, military/aerospace applications or environmental applications, unless MST products are specifically designated as "military grade" or "enhanced plastics" by MST; Only products designated "military grade" by the MST can meet military specifications. Purchaser acknowledges and agrees that any military use of products not designated by MST for military use is at Purchaser's sole risk and that Purchaser is solely responsible for meeting all legal and regulatory requirements in connection with such use.
MST products are not designed or intended for use in automotive applications and the environment unless MST specifically notes that the product complies with ISO/TS 16949 requirements. Purchasers acknowledge and agree that if they use any product not specified in an automotive application, MST shall not be liable for failure to meet the requirements required for the application.